SLPF03 Cross-Linked Shrink Film

SLPF03 Cross-Linked Shrink Film utilizes radiation cross-linking technology during production, transforming the linear molecular chains of resin into a network structure. This significantly enhances the film’s performance in several key areas.

Firstly, it dramatically increases the shrink ratio of the film (up to 80%), allowing for a tighter fit and better packaging appearance. It also boosts the film’s strength and toughness, ensuring more robust packaging. Additionally, the film’s heat-sealing properties are enhanced, creating stronger seals and effectively eliminating the “stringing” effect at seal points. Beyond these improvements, the film’s resistance to heat and cold has also been enhanced, broadening its application range.

Available Thicknesses: 12 microns, 15 microns, 19 microns, 25 microns, 30 microns, 38 microns, and 52 microns.